Study of diffusion processes in contact areas of thermocouples with metals
Abstract
Diffusion processes on the contact areas of the metal-solder-semiconductor system are experimentally studied in this work. Diffusion coefficients, activation energies and pre-exponential factors in samples commutated with solders based on Pb-Sb are determined. It has been established that lead-based solder has a significantly higher inertness to thermoelectric materials. The nickel-phosphorus coating was coated with a nickel-phosphorus coating according to the method described for copper busbars. Thermocouple legs and tire blanks were tinned with Pb - Sb eutectic solder. After tinning, the branches of the thermocouples of 2 × 2 × 4 mm and 3 × 3 × 4 mm dimensions were cut by electric spark cutting and soldered together with the conductor grids. Experimental verification of the obtained results was carried out by manufacturing and testing a cooling thermopile at high temperatures in individual half-cells. Key words: Diffusion, alloy, thermoelement, solder, contact, thermopile, activation energy, chemical activity.