Modeling of temperature processes in orthotropic boards of radio-electronic devices
E. V. RozhkovaTashkent State Transport University of Republic of Uzbekistan, st. Odilhojaev 1, 100167, Tashkent, UzbekistanGulomjon PirnazarovTashkent State Transport University of Republic of Uzbekistan, st. Odilhojaev 1, 100167, Tashkent, UzbekistanMirzokhid MirzaakhmedovTashkent State Transport University of Republic of Uzbekistan, st. Odilhojaev 1, 100167, Tashkent, UzbekistanSunnat KhozhakhmatovTashkent State Transport University of Republic of Uzbekistan, st. Odilhojaev 1, 100167, Tashkent, UzbekistanBakhtigul ArtykovaTashkent State Transport University of Republic of Uzbekistan, st. Odilhojaev 1, 100167, Tashkent, Uzbekistan
ABI
Abstract
The design of electronic equipment that is resistant to external influences is a topical problem. The arrangement of individual circuit parts is modeled in the form of an orthotropic plate. The paper describes the solutions of homogeneous and inhomogeneous thermal conductivity equation for an orthotropic rectangular plate, obtained by the recurrence-operator method. Numerical results are given for two cases of temperature distribution, satisfying zero boundary conditions, during cooling and heating and given initial conditions.
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