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Electrical conductivity, thermopower, and Hall effect of<mml:math xmlns:mml="http://www.w3.org/1998/Math/MathML" display="inline"><mml:mrow><mml:msub><mml:mrow><mml:mi mathvariant="normal">Ti</mml:mi></mml:mrow><mml:mrow><mml:mn>3</mml:mn></mml:mrow></mml:msub></mml:mrow><mml:mrow><mml:msub><mml:mrow><mml:mi mathvariant="normal">AlC</mml:mi></mml:mrow><mml:mrow><mml:mn>2</mml:mn></mml:mrow></mml:msub></mml:mrow><mml:mo>,</mml:mo></mml:math><mml:math xmlns:mml="http://www.w3.org/1998/Math/MathML" display="inline"><mml:mrow><mml:msub><mml:mrow><mml:mi mathvariant="normal">Ti</mml:mi></mml:mrow><mml:mrow><mml:mn>4</mml:mn></mml:mrow></mml:msub></mml:mrow><mml:mrow><mml:msub><mml:mrow><mml:mi mathvariant="normal">AlN</mml:mi></mml:mrow><mml:mrow><mml:mn>3</mml:mn></mml:mrow></mml:msub></mml:mrow><mml:mo>,</mml:mo></mml:math>and<mml:math xmlns:mml="http://www.w3.org/1998/Math/MathML" display="inline"><mml:mrow><mml:msub><mml:mrow><mml:mi mathvariant="normal">Ti</mml:mi></mml:mrow><mml:mrow><mml:mn>3</mml:mn></mml:mrow></mml:msub></mml:mrow><mml:mrow><mml:msub><mml:mrow><mml:mi mathvariant="normal">SiC</mml:mi></mml:mrow><mml:mrow><mml:mn>2</mml:mn></mml:mrow></mml:msub></mml:mrow></mml:math>

Michel W. BarsoumDepartment of Materials Engineering, Drexel University, Philadelphia, Pennsylvania 19104Han‐Ill YooSchool of Materials Science and Engineering, Seoul National University, Seoul, KoreaI. K. PolushinaDepartment of Solid State Physics, Ioffe Phys-Tech Institute, Russian Academy of Sciences, St. Petersburg, RussiaV. Yu. Rud’Yu. V. RudDepartment of Solid State Physics, Ioffe Phys-Tech Institute, Russian Academy of Sciences, St. Petersburg, RussiaT. El‐RaghyDepartment of Materials Engineering, Drexel University, Philadelphia, Pennsylvania 19104
2000lv
ABI

Abstract

In this paper we report on the thermopower and electrical conductivities of ${\mathrm{Ti}}_{4}{\mathrm{AlN}}_{2.9}$ and ${\mathrm{Ti}}_{3}{\mathrm{Al}}_{1.1}{\mathrm{C}}_{1.8}$ in the 300--850 K temperature range. We also measured the room temperature Hall effect in ${\mathrm{Ti}}_{3}{\mathrm{SiC}}_{2},$ ${\mathrm{Ti}}_{4}{\mathrm{AlN}}_{2.9},$ and ${\mathrm{Ti}}_{3}{\mathrm{Al}}_{1.1}{\mathrm{C}}_{1.8}.$ Based on these results we conclude that holes are the majority carriers at room temperature in ${\mathrm{Ti}}_{3}{\mathrm{Al}}_{1.1}{\mathrm{C}}_{1.8}$ and ${\mathrm{Ti}}_{4}{\mathrm{AlN}}_{2.9}.$ At higher temperatures free electrons contribute to the transport properties. ${\mathrm{Ti}}_{3}{\mathrm{SiC}}_{2}$ is a mixed conductor wherein the concentrations and mobilities of the free electrons are, respectively, equal to those of the holes over an extended temperature range. The high conductivity of ${\mathrm{Ti}}_{3}{\mathrm{SiC}}_{2}$ is due to the presence of a large concentration of charge carriers. The lower conductivity of ${\mathrm{Ti}}_{3}{\mathrm{Al}}_{1.1}{\mathrm{C}}_{1.8}$ is due to a dearth of charge carriers. The even lower conductivity of ${\mathrm{Ti}}_{4}{\mathrm{AlN}}_{2.9}$ is attributed to a reduced mobility, most probably due to vacancy scattering of the charge carriers.

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