Skip to main content
Article

Processing and machining mechanism of ultrasonic vibration-assisted grinding on sapphire

Yue ChenInstitute of Manufacturing Engineering, Huaqiao University, Xiamen, Fujian, 361021, ChinaZhongwei HuInstitute of Manufacturing Engineering, Huaqiao University, Xiamen, Fujian, 361021, ChinaYiqing YuInstitute of Mechanical Engineering and Automation, Huaqiao University, Xiamen, Fujian, 361021, ChinaZhiyuan LaiInstitute of Manufacturing Engineering, Huaqiao University, Xiamen, Fujian, 361021, ChinaJiegang ZhuInstitute of Manufacturing Engineering, Huaqiao University, Xiamen, Fujian, 361021, ChinaXipeng XuInstitute of Manufacturing Engineering, Huaqiao University, Xiamen, Fujian, 361021, ChinaQing PengState Key Laboratory of Nonlinear Mechanics, Institute of Mechanics, Chinese Academy of Sciences, Beijing 100190, China
2022en
ABI

Abstract

No abstract available.

Identifiers

Citations and references

Cited by 20 references