A grinding force model in two-dimensional ultrasonic-assisted grinding of silicon carbide
Hongbo LiHubei Digital Manufacturing Key Laboratory, Wuhan University of Technology, Wuhan 430070, PR ChinaTao ChenHubei Digital Manufacturing Key Laboratory, Wuhan University of Technology, Wuhan 430070, PR ChinaZhenyan DuanHubei Digital Manufacturing Key Laboratory, Wuhan University of Technology, Wuhan 430070, PR ChinaYiwen ZhangHubei Digital Manufacturing Key Laboratory, Wuhan University of Technology, Wuhan 430070, PR ChinaHaotian LiHubei Digital Manufacturing Key Laboratory, Wuhan University of Technology, Wuhan 430070, PR China
2022en
ABI
Abstract
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Cited by 20 references