Article

Material removal mechanism of SiC ceramics by elliptic ultrasonic vibration-assisted grinding (EUVAG) using single grain

Kun ZhangSchool of Mechanical Engineering, Suzhou University of Science and Technology, Suzhou, 215009, PR ChinaZhen YinSchool of Mechanical Engineering, Suzhou University of Science and Technology, Suzhou, 215009, PR ChinaChenwei DaiSchool of Mechanical Engineering, Suzhou University of Science and Technology, Suzhou, 215009, PR ChinaQing MiaoSchool of Mechanical Engineering, Suzhou University of Science and Technology, Suzhou, 215009, PR ChinaPeng ZhangSchool of Mechanical Engineering, Suzhou University of Science and Technology, Suzhou, 215009, PR ChinaZiyang CaoSchool of Mechanical Engineering, Suzhou University of Science and Technology, Suzhou, 215009, PR China

2022en

ABI

Abstract

No abstract available.

Identifiers

DOI: 10.1016/j.ceramint.2022.11.184

Citations and references

Cited by 20 references

Metrics — AkademScholar