Article

Bioinspired thermally conducting packaging for heat management of high performance electronic chips

Huawei WangGuangdong Provincial Key Laboratory of Optical Information Materials and Technology & Institute of Electronic Paper Displays, South China Academy of Advanced Optoelectronics, South China Normal University, Guangzhou, 510006, PR ChinaPengfei BaiGuangdong Provincial Key Laboratory of Optical Information Materials and Technology & Institute of Electronic Paper Displays, South China Academy of Advanced Optoelectronics, South China Normal University, Guangzhou, 510006, PR China. [email protected]He CuiGuangdong Provincial Key Laboratory of Optical Information Materials and Technology & Institute of Electronic Paper Displays, South China Academy of Advanced Optoelectronics, South China Normal University, Guangzhou, 510006, PR ChinaXiaotong ZhangGuangdong Provincial Key Laboratory of Optical Information Materials and Technology & Institute of Electronic Paper Displays, South China Academy of Advanced Optoelectronics, South China Normal University, Guangzhou, 510006, PR ChinaYifan TangGuangdong Provincial Key Laboratory of Optical Information Materials and Technology & Institute of Electronic Paper Displays, South China Academy of Advanced Optoelectronics, South China Normal University, Guangzhou, 510006, PR ChinaShaoyu LiangGuangdong Provincial Key Laboratory of Optical Information Materials and Technology & Institute of Electronic Paper Displays, South China Academy of Advanced Optoelectronics, South China Normal University, Guangzhou, 510006, PR ChinaShixiao LiGuangdong Provincial Key Laboratory of Optical Information Materials and Technology & Institute of Electronic Paper Displays, South China Academy of Advanced Optoelectronics, South China Normal University, Guangzhou, 510006, PR ChinaGuofu ZhouAcademy of Shenzhen Guohua Optoelectronics, Shenzhen, 518110, PR China

2025en

ABI

Abstract

Conventional electronic chip packaging generates a huge thermal resistance due to the low thermal conductivity of the packaging materials that separate chip dies and coolant. Here we propose and fabricate a closed high-conducting heat chip package based on passive phase change, using silicon carbide which is physically and structurally compatible with chip die materials. Our “chip on vapor chamber” (CoVC) concept realizes rapid diffusion of hot spots, and eliminates the high energy consumption of refrigeration ordinarily required for heat management. Multi-scale wicks and bionic vein structures are applied to CoVC leading to an increase of 164% in heat transfer performance. The thermal resistance of the package was only a third that of traditional packaging systems. This means that the structure of CoVC has a good thermal conducting ability and can reduce energy consumption for heat dissipation. Conventional electronic chip packaging generates a huge thermal resistance due to the low thermal conductivity of the packaging materials that separate chip dies and coolant. Here Pengfei Bai and colleagues propose and fabricate a closed high-conducting heat chip package for the rapid diffusion of hot spots, eliminating the energy consumption required for heat management of electronic chips.

Identifiers

DOI: 10.1038/s44172-024-00338-6

Citations and references

Cited by 20 references

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