Works citing this work

1 works

Work: ABI:AkademIndex/openalex/2026.other.999735

1. Dual 3D network epoxy composites for 6G electronic packaging with superior terahertz absorption, through-plane thermal conductivity, and electrical insulation

   Yunbo Guo, Noira R. Vokhidova, Yinxiang Lu

   Article20260 citations

   ABIABI:AkademIndex/openalex/2026.article.045444