Key engineering materials

Работ: 26

Книжная серия · ISSN 1013-9826

1. Low-Inductance Packaging Design for SiC Power MOSFET Modules

   Zhao Bo Zhang, Renze Yu, Saeed Jahdi +3

   СтатьяSilicon Carbide Semiconductor TechnologiesKey engineering materials2026Цитирований: 0

   ABIABI:AkademIndex/openalex/2026.article.018298