Статья

Study on Thermal Conductivity and Mechanical Properties of Cyclotriphosphazene Resin-Forced Epoxy Resin Composites

Omar DagdagCentre for Materials Science, College of Science, Engineering, and Technology, University of South Africa, Johannesburg 1710, South AfricaLahoucine El GanaLaboratory of Materials Physics and Subatomic, Department of Physics, Faculty of Sciences, Ibn Tofail University, BP 133, Kenitra 14000, MoroccoRajesh HaldharSchool of Chemical Engineering, Yeungnam University, Gyeongsan 38541, Republic of KoreaАвни БеришаDepartment of Chemistry, Faculty of Natural and Mathematics Science, University of Prishtina, 10000 Prishtina, KosovoSeong‐Cheol KimSchool of Chemical Engineering, Yeungnam University, Gyeongsan 38541, Republic of KoreaElyor BerdimurodovFaculty of Chemistry, National University of Uzbekistan, Tashkent 100034, UzbekistanOthman HamedDepartment of Chemistry, An-Najah National University, Nablus P.O. Box 7, PalestineShehdeh JodehDepartment of Chemistry, An-Najah National University, Nablus P.O. Box 7, PalestineEkemini D. AkpanCentre for Materials Science, College of Science, Engineering, and Technology, University of South Africa, Johannesburg 1710, South AfricaEno E. EbensoCentre for Materials Science, College of Science, Engineering, and Technology, University of South Africa, Johannesburg 1710, South Africa

Crystalsjournal2023en

ABI

Аннотация

Cyclotriphosphazenes, a variety of inorganic rings together with a curing ingredient, 4,4′-methylene dianiline (MDA), are mainly used to enhance the thermal conductivity and mechanical characteristics of epoxy resin (DGEBA). Three DGEBA@MDA, HGCP@MDA, and thermosets were produced, and their curing behaviors were investigated. Using a molecular dynamics (MD) approach, the impact of cyclotriphosphazene on the characteristics of DGEBA composites is thoroughly explored in this paper. Results indicated that the glass transition temperatures (Tg) of DGEBA containing HGCP had slightly decreased compared to DGEBA. With the addition of HGCP to DGEBA, epoxy resin (DGEBA@HGCP@MDA) has a high thermal conductivity of 0.215284 W/m·K, with an increase of 116.04% more than pure DGEBA (0.185524 W/m·K). Moreover, the DGEBA@HGCP@MDA composite has high mechanical strength with a specific Young’s modulus of 5.4902 GPa. In order to forecast and analyze certain performances directly associated with the microstructure characteristics of the various cross-linked resin systems and their composite materials, an MD simulation approach will be quite valuable.

Темы

Flame retardant materials and properties Synthesis and properties of polymers Epoxy Resin Curing Processes

Идентификаторы

DOI: 10.3390/cryst13030478

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