Статья

Heat Transfer Performance and Structural Optimization of a Novel Micro-channel Heat Sink

Jianhua XiangSchool of Mechanical and Electrical Engineering, Guangzhou University, Guangzhou, 510006, ChinaLiangming DengSchool of Mechanical and Electrical Engineering, Guangzhou University, Guangzhou, 510006, ChinaChao ZhouSchool of Mechanical and Electrical Engineering, Guangzhou University, Guangzhou, 510006, ChinaHongliang ZhaoSchool of Mechanical and Electrical Engineering, Guangzhou University, Guangzhou, 510006, ChinaJiale HuangDepartment of Mechanical and Electrical Engineering, Xiamen University, Xiamen, 361005, ChinaSulian TaoDepartment of Mechanical Engineering, Guangdong Technical College of Water Resources and Electric Engineering, Guangzhou, 510925, China

2022en

ABI

Аннотация

Abstract With the advent of the 5G era, the design of electronic equipment is developing towards thinness, intelligence and multi-function, which requires higher cooling performance of the equipment. Micro-channel heat sink is promising for the heat dissipation of super-thin electronic equipment. In this study, thermal resistance theoretical model of the micro-channel heat sink was first established. Then, fabrication process of the micro-channel heat sink was introduced. Subsequently, heat transfer performance of the fabricated micro-channel heat sink was tested through the developed testing platform. Results show that the developed micro-channel heat sink has more superior heat dissipation performance over conventional metal solid heat sink and it is well suited for high power LEDs application. Moreover, the micro-channel structures in the heat sink were optimized by orthogonal test. Based on the orthogonal optimization, heat dissipation performance of the micro-channel radiator was further improved.

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Идентификаторы

DOI: 10.1186/s10033-022-00704-5

Цитирования и источники

Цитирований: 8Использованных источников: 0

Показатели — AkademScholar