Перейти к основному содержанию
AkademIndex

Продукты

Для разработчиков

AkademBaseОткрытый API экосистемы
Обзорная статья

Recent Advances and Challenges Toward Application of Fibers and Textiles in Integrated Photovoltaic Energy Storage Devices

Amjid RafiqueCENIMAT|I3N, Department of Materials Science, School of Science and Technology, NOVA University Lisbon, Campus de Caparica, 2829-516, Caparica, Portugal. [email protected]I. FerreiraCENIMAT|I3N, Department of Materials Science, School of Science and Technology, NOVA University Lisbon, Campus de Caparica, 2829-516, Caparica, PortugalGhulam AbbasCENIMAT|I3N, Department of Materials Science, School of Science and Technology, NOVA University Lisbon, Campus de Caparica, 2829-516, Caparica, PortugalAna Catarina BaptistaCENIMAT|I3N, Department of Materials Science, School of Science and Technology, NOVA University Lisbon, Campus de Caparica, 2829-516, Caparica, Portugal
2023en
ABI

Аннотация

Flexible microelectronic devices have seen an increasing trend toward development of miniaturized, portable, and integrated devices as wearable electronics which have the requirement for being light weight, small in dimension, and suppleness. Traditional three-dimensional (3D) and two-dimensional (2D) electronics gadgets fail to effectively comply with these necessities owing to their stiffness and large weights. Investigations have come up with a new family of one-dimensional (1D) flexible and fiber-based electronic devices (FBEDs) comprising power storage, energy-scavenging, implantable sensing, and flexible displays gadgets. However, development and manufacturing are still a challenge owing to their small radius, flexibility, low weight, weave ability and integration in textile electronics. This paper will provide a detailed review on the importance of substrates in electronic devices, intrinsic property requirements, fabrication classification and applications in energy harvesting, energy storage and other flexible electronic devices. Fiber- and textile-based electronic devices for bulk/scalable fabrications, encapsulation, and testing are reviewed and presented future research ideas to enhance the commercialization of these fiber-based electronics devices.

Перевод пока недоступен

Идентификаторы

Цитирования и источники

Цитирований: 2Использованных источников: 0