Two-dimensional materials for next-generation computing technologies
Chunsen LiuSchool of Computer Science, Fudan University, Shanghai, ChinaHuawei ChenState Key Laboratory of ASIC and System, School of Microelectronics, Fudan University, Shanghai, ChinaShuiyuan WangState Key Laboratory of ASIC and System, School of Microelectronics, Fudan University, Shanghai, ChinaQi LiuFrontier Institute of Chip and System, Fudan University, Shanghai, ChinaYu–Gang JiangSchool of Computer Science, Fudan University, Shanghai, ChinaDavid Wei ZhangState Key Laboratory of ASIC and System, School of Microelectronics, Fudan University, Shanghai, ChinaMing LiuFrontier Institute of Chip and System, Fudan University, Shanghai, ChinaPeng ZhouState Key Laboratory of ASIC and System, School of Microelectronics, Fudan University, Shanghai, China. [email protected]
2020en
ABI
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