Перейти к основному содержанию
AkademIndex

Продукты

Для разработчиков

AkademBaseОткрытый API экосистемы
Статья

Significance of thermal conductivity and heat transfer mechanism through copper nanofluid with convective condition via heated Riga plate

Pardeep KumarDepartment of Mathematics and Statistics, Chaudhary Charan Singh Haryana Agricultural University, Hisar 125004 Haryana, IndiaHemant PooniaDepartment of Mathematics and Statistics, Chaudhary Charan Singh Haryana Agricultural University, Hisar 125004 Haryana, IndiaRishu GandhiDepartment of Mathematics, Birla Institute of Technology and Science, Pilani, Rajasthan, IndiaSombirDepartment of Mathematics and Statistics, Chaudhary Charan Singh Haryana Agricultural University, Hisar 125004 Haryana, IndiaLiaqat AliSchool of Sciences, Xi’an Technological University, Xi’an 710021, P. R. China
2023en
ABI

Аннотация

This study investigates the heat and mass transfer of magnetohydrodynamic nanofluids via the Riga plate subjected to convective boundary conditions, including the thermal radiation parameter. Utilizing variable thermal conductivity and mixed convection effects, the heat transfer process is investigated. The peculiarity of the flow model enables us to investigate the importance of thermophoresis and Brownian motion to the kinetics of Newtonian fluids. The governing partial differential equations are converted into non-dimensional ordinary differential equations using proper similarity transformations and numerically solved using bvp4c in Matlab. The graphs explore the effects of pertinent parameters on the transference of heat, mass and velocity profiles. As the Biot number [Formula: see text] increases, so does the thermal boundary layer. The Nusselt number intensifies with radiation parameter but decreases with intensifying magnetic field parameter [Formula: see text], Eckert number [Formula: see text] and Brownian motion parameter [Formula: see text]. The influence of several physical quantities is illustrated and displayed through graphs and tables. Furthermore, it is observed that the thickness of the temperature profile is increased by combining the Biot number, the thermal radiation parameter, the thermal conductivity parameter and the modified Hartmann number.

Перевод пока недоступен

Идентификаторы

Цитирования и источники

Цитирований: 2Использованных источников: 0