Machinability improvement in three-dimensional (3D) ultrasonic vibration assisted diamond wire sawing of SiC
Lutao YanSchool of Automation, Beijing University of Posts and Telecommunications, ChinaXinrong ZhangSchool of Automation, Beijing University of Posts and Telecommunications, ChinaHaiyuan LiSchool of Automation, Beijing University of Posts and Telecommunications, ChinaQinjian ZhangSchool of Mechanical Electrical Engineering, Beijing Information Science and Technology University, 100192, Beijing, China
2021en
ABI
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