Перейти к основному содержанию
AkademIndex

Продукты

Для разработчиков

AkademBaseОткрытый API экосистемы
Статья

General Relationship for the Thermal Oxidation of Silicon

B. E. DealFairchild Semiconductor, A Division of Fairchild Camera and Instrument Corporation, Palo Alto, CaliforniaAndrew S. GroveFairchild Semiconductor, A Division of Fairchild Camera and Instrument Corporation, Palo Alto, California
1965en
ABI

Аннотация

The thermal-oxidation kinetics of silicon are examined in detail. Based on a simple model of oxidation which takes into account the reactions occurring at the two boundaries of the oxide layer as well as the diffusion process, the general relationship x02+Ax0=B(t+τ) is derived. This relationship is shown to be in excellent agreement with oxidation data obtained over a wide range of temperature (700°–1300°C), partial pressure (0.1–1.0 atm) and oxide thickness (300–20 000 Å) for both oxygen and water oxidants. The parameters A, B, and τ are shown to be related to the physico-chemical constants of the oxidation reaction in the predicted manner. Such detailed analysis also leads to further information regarding the nature of the transported species as well as space-charge effects on the initial phase of oxidation.

Перевод пока недоступен

Идентификаторы

Цитирования и источники

Цитирований: 3Использованных источников: 0