Sintering mechanism of size-controllable Cu-Ag core–shell nanoparticles for flexible conductive film with high conductivity, antioxidation, and electrochemical migration resistance
Wenwu ZhangSauvage Laboratory for Smart Materials, Shenzhen Key Laboratory of Flexible Printed Electronics Technology, School of Materials Science and Engineering, Harbin Institute of Technology (Shenzhen), Shenzhen 518055, People’s Republic of ChinaYan-Hong ZhouThe State Key Laboratory of Advanced Welding and Joining, School of Materials Science and Engineering, Harbin Institute of Technology at Shenzhen, Shenzhen, 518055, People’s Republic of ChinaYiping DingSauvage Laboratory for Smart Materials, Shenzhen Key Laboratory of Flexible Printed Electronics Technology, School of Materials Science and Engineering, Harbin Institute of Technology (Shenzhen), Shenzhen 518055, People’s Republic of ChinaLinlin SongEducation Center of Experiments and Innovations, Harbin Institute of Technology (Shenzhen), Shenzhen 518055, People’s Republic of ChinaQunhui YuanSauvage Laboratory for Smart Materials, Shenzhen Key Laboratory of Flexible Printed Electronics Technology, School of Materials Science and Engineering, Harbin Institute of Technology (Shenzhen), Shenzhen 518055, People’s Republic of ChinaWeiwei ZhaoThe State Key Laboratory of Advanced Welding and Joining, School of Materials Science and Engineering, Harbin Institute of Technology at Shenzhen, Shenzhen, 518055, People’s Republic of ChinaCheng‐Yan XuSauvage Laboratory for Smart Materials, Shenzhen Key Laboratory of Flexible Printed Electronics Technology, School of Materials Science and Engineering, Harbin Institute of Technology (Shenzhen), Shenzhen 518055, People’s Republic of ChinaJun WeiShenzhen Key Laboratory of Flexible Printed Electronics Technology, Harbin Institute of Technology (Shenzhen), People’s Republic of ChinaMingyu LiSauvage Laboratory for Smart Materials, Shenzhen Key Laboratory of Flexible Printed Electronics Technology, School of Materials Science and Engineering, Harbin Institute of Technology (Shenzhen), Shenzhen 518055, People’s Republic of ChinaHongjun JiSauvage Laboratory for Smart Materials, Shenzhen Key Laboratory of Flexible Printed Electronics Technology, School of Materials Science and Engineering, Harbin Institute of Technology (Shenzhen), Shenzhen 518055, People’s Republic of China
2022en
ABI
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