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Focused beams of fast neutral atoms in glow discharge plasma

Sergey N. GrigorievMoscow State University of Technology “STANKIN ”, 1 Vadkovsky per., Moscow 127055, Russian FederationYury A. MelnikMoscow State University of Technology “STANKIN ”, 1 Vadkovsky per., Moscow 127055, Russian FederationAlexander MetelMoscow State University of Technology “STANKIN ”, 1 Vadkovsky per., Moscow 127055, Russian FederationМ. A. VolosovaMoscow State University of Technology “STANKIN ”, 1 Vadkovsky per., Moscow 127055, Russian Federation
2017en
ABI

Аннотация

Glow discharge with electrostatic confinement of electrons in a vacuum chamber allows plasma processing of conductive products in a wide pressure range of p = 0.01 – 5 Pa. To assist processing of a small dielectric product with a concentrated on its surface beam of fast neutral atoms, which do not cause charge effects, ions from the discharge plasma are accelerated towards the product and transformed into fast atoms. The beam is produced using a negatively biased cylindrical or a spherical grid immersed in the plasma. Ions accelerated by the grid turn into fast neutral atoms at p > 0.1 Pa due to charge exchange collisions with gas atoms in the space charge sheaths adjoining the grid. The atoms form a diverging neutral beam and a converging beam propagating from the grid in opposite directions. The beam propagating from the concave surface of a 0.24-m-wide cylindrical grid is focused on a target within a 10-mm-wide stripe, and the beam from the 0.24-m-diameter spherical grid is focused within a 10-mm-diameter circle. At the bias voltage U = 5 kV and p ∼ 0.1 Pa, the energy of fast argon atoms is distributed continuously from zero to eU ∼ 5 keV. The pressure increase to 1 Pa results in the tenfold growth of their equivalent current and a decrease in the mean energy by an order of magnitude, which substantially raises the efficiency of material etching. Sharpening by the beam of ceramic knife-blades proved that the new method for the generation of concentrated fast atom beams can be effectively used for the processing of dielectric materials in vacuum.

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