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Fabrication of 6H-SiC light-emitting diodes by a rotation dipping technique: Electroluminescence mechanisms

M. IkedaDepartment of Electronics, Faculty of Engineering, Kyoto University, Kyoto 606, JapanTomokatsu HayakawaDepartment of Electronics, Faculty of Engineering, Kyoto University, Kyoto 606, JapanShin-ichi YamagiwaDepartment of Electronics, Faculty of Engineering, Kyoto University, Kyoto 606, JapanH. MatsunamiDepartment of Electronics, Faculty of Engineering, Kyoto University, Kyoto 606, JapanTetsuro TanakaDepartment of Electronics, Faculty of Engineering, Kyoto University, Kyoto 606, Japan
1979en
ABI

Аннотация

Various light-emitting diodes of 6H–SiC, doped in the n layers with Al, Ga, or B acceptors and N donors, have been fabricated using a rotation dipping technique. A detailed study of electroluminescence mechanisms from ∼100 to 400 K has been carried out using photoluminescence, electroluminescence, and time-resolved spectra. At low temperatures the radiation originates mainly in the p layer, and around room temperature in the n layer. The luminescence mechanisms are free-exciton recombinations for the peak at ∼425 nm, donor-acceptor pair recombinations for the main broad band, transitions within localized centers for the peak at ∼455 nm, and recombinations due to divacancies for the series of peaks beginning at ∼470 nm. The dependence of the electroluminescence efficiency on the N concentration in the n layers is studied and methods to improve efficiency are discussed. The maximum external quantum efficiencies obtained were 1.2×10−5 for Al-doped, 9×10−6 for Ga-doped, and 2.5×10−5 for B-doped diodes, and were improved by a factor of 2 by using an epoxy coating.

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