← Назад к работе
Работы, цитирующие эту работу
Работ: 2
Работа: Effects of process parameters and chamber structure on plasma uniformity in a large-area capacitively coupled discharge
Enhancing plasma uniformity in SiH4/NH3 capacitively coupled plasmas via dielectric structure adjustment positioning adjacent to the power electrode
Sen Wang, Quan‐Zhi Zhang, Maksudbek Yusupov +1
СтатьяPlasma Diagnostics and ApplicationsJournal of Vacuum Science & Technology B Nanotechnology and Microelectronics Materials Processing Measurement and Phenomena2025Цитирований: 0ABI