Перейти к основному содержанию
AkademIndex

Продукты

Для разработчиков

AkademBaseОткрытый API экосистемы
Статья

24.7% Record Efficiency HIT Solar Cell on Thin Silicon Wafer

Mikio TaguchiSolar Business Unit, Eco Solutions Company of Panasonic Group, Kobe, JapanAyumu YanoSolar Business Unit, Eco Solutions Company of Panasonic Group, Kobe, JapanSatoshi TohodaSolar Business Unit, Eco Solutions Company of Panasonic Group, Kobe, JapanKenta MatsuyamaSolar Business Unit, Eco Solutions Company of Panasonic Group, Kobe, JapanYuya NakamuraSolar Business Unit, Eco Solutions Company of Panasonic Group, Kobe, JapanTakeshi NishiwakiSolar Business Unit, Eco Solutions Company of Panasonic Group, Kobe, JapanKazunori FujitaSolar Business Unit, Eco Solutions Company of Panasonic Group, Kobe, JapanEiji MaruyamaSolar Business Unit, Eco Solutions Company of Panasonic Group, Kobe, Japan
2013en
ABI

Аннотация

A new record conversion efficiency of 24.7% was attained at the research level by using a heterojunction with intrinsic thin-layer structure of practical size (101.8 cm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> , total area) at a 98-μm thickness. This is a world height record for any crystalline silicon-based solar cell of practical size (100 cm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> and above). Since we announced our former record of 23.7%, we have continued to reduce recombination losses at the hetero interface between a-Si and c-Si along with cutting down resistive losses by improving the silver paste with lower resistivity and optimization of the thicknesses in a-Si layers. Using a new technology that enables the formation of a-Si layer of even higher quality on the c-Si substrate, while limiting damage to the surface of the substrate, the V <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">oc</sub> has been improved from 0.745 to 0.750 V. We also succeeded in improving the fill factor from 0.809 to 0.832.

Перевод пока недоступен

Идентификаторы

Цитирования и источники

Цитирований: 2Использованных источников: 0