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Analysis of hot-carrier-induced degradation mode on pMOSFET's

F. MatsuokaSemiconductor Device Engineering Laboratoly, Toshiba Corporation, Kawasaki, Kanagawa, JapanHiroshi IwaiULSl Research Center, Toshiba Corporation, Kawasaki, Kanagawa, JapanH. HayashidaSemiconductor Device Engineering Laboratoly, Toshiba Corporation, Kawasaki, Kanagawa, JapanK. HamaToshiba Microelectronics Corporation, Kawasaki, Kanagawa, JapanY. ToyoshimaSemiconductor Device Engineering Laboratoly, Toshiba Corporation, Kawasaki, Kanagawa, JapanK. MaeguchiSemiconductor Device Engineering Laboratoly, Toshiba Corporation, Kawasaki, Kanagawa, Japan
1990en
ABI

Аннотация

Hot-carrier-induced degradation surface-channel (p/sup +/ polysilicon gate) and buried-channel (n/sup +/ polysilicon gate) pMOSFETs is discussed. In the shallow gate bias region, a hot-carrier degradation mode by drain avalanche hot hole injection was found for the surface-channel pMOSFETs. Trapped holes and interface state generation, which were not observed in the buried-channel pMOSFETs, were detected. In this gate bias region, the degradation for the surface-channel structure is smaller than that for the buried-channel structure. Three reasons for the smaller degradation in the surface-channel structure are discussed. The deep-gate bias region was also investigated. In this region, an interface-state generation mode without the threshold-voltage shift was found for both surface- and buried-channel pMOSFETs. This interface state generation is caused by channel hot hole injection.< <ETX xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">&gt;</ETX>

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