A Micromachined Millimeter-Wave Cavity Resonator on Silicon and Quartz Substrates
Ki‐Jae SongRFIC Research and Education Center & Mission Technology Research Center, Kwangwoon University,Bup-Sang Yoon Bup-Sang YoonRFIC Research and Education Center & Mission Technology Research Center, Kwangwoon University,Jong‐Chul LeeRFIC Research and Education Center & Mission Technology Research Center, Kwangwoon University,Byungje Lee Byungje LeeRFIC Research and Education Center & Mission Technology Research Center, Kwangwoon University,Jong‐Heon KimRFIC Research and Education Center & Mission Technology Research Center, Kwangwoon University,Nam‐Young KimRFIC Research and Education Center & Mission Technology Research Center, Kwangwoon University,Jae-Yeong Park Jae-Yeong ParkMicrosystem and RF Team, Materials and Devices Laboratory, LG Electronics Institute of Technology,Geun-Ho KimMicrosystem and RF Team, Materials and Devices Laboratory, LG Electronics Institute of Technology,Jong-Uk Bu Jong-Uk BuMicrosystem and RF Team, Materials and Devices Laboratory, LG Electronics Institute of Technology,
2001en
ABI
Аннотация
In this letter, a Ka-band cavity resonator using micromachining process is presented. A two-port cavity resonator is designed using the three-dimensional (3-D) design software, HP HFSS. The cavity resonator is fabricated on a Si substrate and bonded with a Quartz wafer. The resonator shows the resonant frequency of 39 GHz, the insertion loss of 4.6 dB, and the loaded quality factor ( Q L ) and unloaded quality factor ( Q U ) of 44.3 and 107, respectively.
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