Статья

Super-Flexibility and High-Temperature Adhesion of Epoxy Structural Adhesives Endowed by Homogeneous Rigid–Flexible Crosslinking Networks

Ying GeThe State Key Laboratory of Polymer Materials Engineering, Polymer Research Institute of Sichuan University, Chengdu 610065, ChinaXueqin ZhangThe State Key Laboratory of Polymer Materials Engineering, Polymer Research Institute of Sichuan University, Chengdu 610065, ChinaTianwen DaiThe State Key Laboratory of Polymer Materials Engineering, Polymer Research Institute of Sichuan University, Chengdu 610065, ChinaYuan WangThe State Key Laboratory of Polymer Materials Engineering, Polymer Research Institute of Sichuan University, Chengdu 610065, ChinaYouquan LingThe State Key Laboratory of Polymer Materials Engineering, Polymer Research Institute of Sichuan University, Chengdu 610065, ChinaZhiwei XuYangzhou Runyou Composite Material Co., Ltd., Hjjghjgh, YangZhou 225000, ChinaZhengguang HengThe State Key Laboratory of Polymer Materials Engineering, Polymer Research Institute of Sichuan University, Chengdu 610065, ChinaMei LiangThe State Key Laboratory of Polymer Materials Engineering, Polymer Research Institute of Sichuan University, Chengdu 610065, ChinaHuawei ZouThe State Key Laboratory of Polymer Materials Engineering, Polymer Research Institute of Sichuan University, Chengdu 610065, China

2022en

ABI

Аннотация

Epoxy adhesives that combine flexibility, high-temperature adhesion property, and medium–low-temperature curing ability are an urgent need in the microelectronic device era. Unfortunately, it is still a challenge so far. In this context, two kinds of curing agents are combined to construct homogeneous rigid–flexible crosslinking networks via the stepwise curing method for preparing an epoxy adhesive with prominent deformation ability and high-temperature adhesive strength. Detailed analysis showed that the crosslinking network constructed by the stepwise curing method was higher and more homogenous than that of the one-step curing method. Benefitting from the homogeneous rigid–flexible crosslinking network, the elongation at break and high-temperature adhesion strength (200 °C) of the epoxy adhesive prepared by the stepwise method were up to about 100% and 1.60 MPa, respectively, which were about 1677.7 and 112.5% higher than those of the epoxy adhesive cured by the one-step curing method. The epoxy adhesive with medium–low-temperature curing ability, excellent flexibility, and high-temperature adhesion was first reported. It is expected that this work could provide some inspiration to design the special epoxy adhesives.

Перевод пока недоступен

Идентификаторы

DOI: 10.1021/acs.iecr.2c01428

Цитирования и источники

Цитирований: 2Использованных источников: 0

Показатели — AkademScholar