Статья

Enhanced thermal and mechanical performance of 3D architected micro-channel heat exchangers

Yongjia WuSchool of Civil Engineering and Architecture, Wuhan University of Technology, Wuhan, Hubei, 430070, ChinaCongcong ZhiSchool of Civil Engineering and Architecture, Wuhan University of Technology, Wuhan, Hubei, 430070, ChinaZhiyi WangSchool of Civil Engineering and Architecture, Wuhan University of Technology, Wuhan, Hubei, 430070, ChinaYanyu ChenDepartment of Mechanical Engineering, University of Louisville, Louisville, KY, 40292, USACaixia WangSchool of Civil Engineering and Architecture, Wuhan University of Technology, Wuhan, Hubei, 430070, ChinaQiong ChenSchool of Civil Engineering and Architecture, Wuhan University of Technology, Wuhan, Hubei, 430070, ChinaGangfeng TanSchool of Automotive Engineering, Wuhan University of Technology, Wuhan, Hubei, 430070, ChinaTingzhen MingSchool of Civil Engineering and Architecture, Wuhan University of Technology, Wuhan, Hubei, 430070, China

2023en

ABI

Аннотация

Many crystals in nature have simple interatomic microstructures, such as simple cubic (SC), body-centered cubic (BCC), and face-centered cubic (FCC) lattice symmetries, making these structures extremely stable. Inspired by these arrangements, a series of architected micro-channel heat exchangers with rationally designed 3D microstructures were established. A multi-physics mathematical model using thermal-fluid-structure interaction (TFSI) was employed to investigate the coupled heat transfer performance and mechanical properties of these architected heat exchangers. When compared with the corrugated straight plate (CSP) microchannel heat exchanger, the thermal-hydraulic performance factors (TPC) of FCC and BCC microchannel heat transfer were 2.20 and 1.70 times that of SC microchannel heat exchanger, respectively. The micro-channel heat exchanger with FCC architectures could enhance the convective heat transfer performance by 201.0%, while the micro-channel heat exchanger with SC architectures reduced the Von-Mises equivalent (VME) stress by 20.0% when compared with the conventional 2D CSP heat exchanger. The proposed architected micro-channel heat exchangers could find a wide range of potential applications ranging from power electronics in electric vehicles to concentrated solar power systems, where both good convective heat transfer performance and high mechanical strength are simultaneously pursued.

Перевод пока недоступен

Идентификаторы

DOI: 10.1016/j.heliyon.2023.e13902

Цитирования и источники

Цитирований: 2Использованных источников: 0

Показатели — AkademScholar