Статья

Flexible thermal interface based on self-assembled boron arsenide for high-performance thermal management

Ying CuiDepartment of Mechanical and Aerospace Engineering, University of California, Los Angeles (UCLA), Los Angeles, CA, 90095, USAZihao QinDepartment of Mechanical and Aerospace Engineering, University of California, Los Angeles (UCLA), Los Angeles, CA, 90095, USAHuan WuDepartment of Mechanical and Aerospace Engineering, University of California, Los Angeles (UCLA), Los Angeles, CA, 90095, USAMan LiDepartment of Mechanical and Aerospace Engineering, University of California, Los Angeles (UCLA), Los Angeles, CA, 90095, USAYongjie HuDepartment of Mechanical and Aerospace Engineering, University of California, Los Angeles (UCLA), Los Angeles, CA, 90095, USA

2021en

ABI

Аннотация

Abstract Thermal management is the most critical technology challenge for modern electronics. Recent key materials innovation focuses on developing advanced thermal interface of electronic packaging for achieving efficient heat dissipation. Here, for the first time we report a record-high performance thermal interface beyond the current state of the art, based on self-assembled manufacturing of cubic boron arsenide (s-BAs). The s-BAs exhibits highly desirable characteristics of high thermal conductivity up to 21 W/m·K and excellent elastic compliance similar to that of soft biological tissues down to 100 kPa through the rational design of BAs microcrystals in polymer composite. In addition, the s-BAs demonstrates high flexibility and preserves the high conductivity over at least 500 bending cycles, opening up new application opportunities for flexible thermal cooling. Moreover, we demonstrated device integration with power LEDs and measured a superior cooling performance of s-BAs beyond the current state of the art, by up to 45 °C reduction in the hot spot temperature. Together, this study demonstrates scalable manufacturing of a new generation of energy-efficient and flexible thermal interface that holds great promise for advanced thermal management of future integrated circuits and emerging applications such as wearable electronics and soft robotics.

Перевод пока недоступен

Идентификаторы

DOI: 10.1038/s41467-021-21531-7

Цитирования и источники

Цитирований: 3Использованных источников: 0

Показатели — AkademScholar