Thermal management enhancement of electronic chips based on novel technologies
Haopeng ChenCollege of Automotive Engineering, Jilin University, Jilin, ChinaTianshi ZhangCollege of Automotive Engineering, Jilin University, Jilin, ChinaQing GaoCollege of Automotive Engineering, Jilin University, Jilin, ChinaJianwei LvFAW-Volkswagen Automotive Co. Ltd., First Automobile Works Group, Jilin, ChinaHaibo ChenCollege of Automotive Engineering, Jilin University, Jilin, ChinaHaizhen HuangCollege of Automotive Engineering, Jilin University, Jilin, China
2025en
ABI
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