High-performance integrated thermoelectric coolers for electronics cooling

Thermoelectric coolers (TECs), which can directly convert energy between electricity and heat, have emerged as a promising solution for electronics cooling. However, the practical application of TECs remains limited due to insufficient cooling performance. Here, we present an integrated water-cooled TEC (i-TEC) with internal flow channels embedded in ceramic substrates, effectively eliminating the limitations of traditional thermal interfaces. The i-TEC achieves superior cooling performance, reducing the temperature of an 80 W heat source by nearly 20 °C compared to conventional TECs and attaining a coefficient of performance up to 3.26. Practical applications demonstrate its capability to lower the maximum temperature of a smartphone by up to 16 °C, significantly enhancing user experience and device stability. These results highlight the great potential of these i-TECs for advanced thermal management in electronic devices. Thermoelectric coolers are useful for cooling electronics, but their insufficient cooling performance limits broad applicability. Here, an integrated thermoelectric cooler with internal water flow channels embedded in ceramic substrates shows strong cooling performance compared to conventional coolers

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