A. J. Tosser

1 та иш

1. Effect of grain boundary scattering on the TCR of thin tin films

   C. R. Pichard, Yu. F. Komnik, Б. И. Белевцев +1

   МақолаCopper Interconnects and ReliabilityJournal of Materials Science Letters19830 иқтибос

   ABIABI:AkademIndex/openalex/1983.article.000029