Silica glasses for AI computing chips: Achieving low dielectric constant and high mechanical strength via rapid light shaping and low temperature sintering
Shibo ZhaoUniversity of Chinese Academy of Sciences徐娅娇Purification Equipment Research Institute of CSIC, Handan 056000, ChinaHongyun ZengShanghai Institute of Ceramics, Chinese Academy of Sciences, Shanghai 200050, ChinaSultan SuleymanovInstitute of Materials Science of Uzbekistan Academy of Sciences, Tashkent 100084, UzbekistanChenxiang MaShanghai Institute of Ceramics, Chinese Academy of Sciences, Shanghai 200050, ChinaHexing YuanShanghai Institute of Ceramics, Chinese Academy of Sciences, Shanghai 200050, ChinaXuefeng TangShanghai Institute of Ceramics, Chinese Academy of Sciences, Shanghai 200050, ChinaYiyang ZhuShanghai Institute of Ceramics, Chinese Academy of Sciences, Shanghai 200050, ChinaMinghui ZhangShanghai Institute of Ceramics, Chinese Academy of Sciences, Shanghai 200050, China
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