Dual 3D network epoxy composites for 6G electronic packaging with superior terahertz absorption, through-plane thermal conductivity, and electrical insulation
Yunbo GuoCollege of Smart Materials and Future Energy, Fudan University, Shanghai, 200433, ChinaNoira R. VokhidovaInstitute of Polymer Chemistry and Physics, Academy of Sciences of the Republic of Uzbekistan, Tashkent, 100128, UzbekistanYinxiang LuCollege of Smart Materials and Future Energy, Fudan University, Shanghai, 200433, China
2026en
ABI
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