Modeling the effects of Undeformed Chip Volume (UCV) on residual stresses during the milling of curved thin-walled parts
Xiaohui JiangCollege of Mechanical Engineering, University of Shanghai for Science & Technology, Yangpu, Shanghai, ChinaXiangjing KongCollege of Mechanical Engineering, University of Shanghai for Science & Technology, Yangpu, Shanghai, ChinaZhenya ZhangCollege of Mechanical Engineering, University of Shanghai for Science & Technology, Yangpu, Shanghai, ChinaZhouping WuShanghai Aerospace Equipment Manufacturing Company Limited, ChinaZishan DingCollege of Mechanical Engineering, University of Shanghai for Science & Technology, Yangpu, Shanghai, ChinaMiaoxian GuoCollege of Mechanical Engineering, University of Shanghai for Science & Technology, Yangpu, Shanghai, China
2019en
ABI
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