Thermal management of electronic devices using pin-fin based cascade microencapsulated PCM/expanded graphite composite
Qinlong RenKey Laboratory of Thermo-Fluid Science and Engineering of MOE, School of Energy and Power Engineering, Xi'an Jiaotong University, Xi'an 710049, ChinaPenghua GuoDepartment of Fluid Machinery and Engineering, School of Energy and Power Engineering, Xi'an Jiaotong University, Xi'an 710049, ChinaJianjun ZhuKey Laboratory of Thermo-Fluid Science and Engineering of MOE, School of Energy and Power Engineering, Xi'an Jiaotong University, Xi'an 710049, China
2020en
ABI
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