Design of a GaN-Based Flip Chip Light Emitting Diode (FC-LED) with au Bumps & Thermal Analysis with Different Sizes and Adhesive Materials for Performance Considerations
Manvinder SharmaChandigarh Group of Colleges, Landran, Mohali, Punjab, IndiaDigvijay PandeyDepartment of Technical Education, IET, Dr. A.P.J. Abdul, Kalam Technical University, Lucknow, Uttar Pradesh, IndiaDishant KhoslaChandigarh Group of Colleges, Landran, Mohali, Punjab, IndiaSumeet GoyalChandigarh Group of Colleges, Landran, Mohali, Punjab, IndiaBinay Kumar PandeyDepartment of Information Technology, College of Technology, Govind Ballabh Pant University of Agriculture and Technology, Pantnagar, IndiaAnuj GuptaChandigarh Group of Colleges, Landran, Mohali, Punjab, India
2021en
ABI
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