Ушбу ишга иқтибос қилган ишлар

2 та иш

Иш: A three-dimensional model for grain boundary resistivity in metal films

1. Electrical properties of fine crystalline and amorphous metal films, obtained by low temperature condensation (Review)

   Yu. F. Komnik

   МақолаCopper Interconnects and ReliabilitySoviet Journal of Low Temperature Physics19820 иқтибос

   ABIABI:AkademIndex/openalex/1982.article.000117

2. Effect of grain boundary scattering on the TCR of thin tin films

   C. R. Pichard, Yu. F. Komnik, Б. И. Белевцев +1

   МақолаCopper Interconnects and ReliabilityJournal of Materials Science Letters19830 иқтибос

   ABIABI:AkademIndex/openalex/1983.article.000029