Ушбу ишга иқтибос қилган ишлар

1 та иш

Иш: Relationship of electrical resistance of polycrystalline tin films to structural characteristics

1. Effect of grain boundary scattering on the TCR of thin tin films

   C. R. Pichard, Yu. F. Komnik, Б. И. Белевцев +1

   МақолаCopper Interconnects and ReliabilityJournal of Materials Science Letters19830 иқтибос

   ABIABI:AkademIndex/openalex/1983.article.000029