Zishan Ding

1 ta ish

University of Shanghai for Science and Technology

1. Modeling the effects of Undeformed Chip Volume (UCV) on residual stresses during the milling of curved thin-walled parts

   Xiaohui Jiang, Xiangjing Kong, Zhenya Zhang +3

   Maqola20192 iqtibos

   ABIABI:AkademIndex/2026.other.146933