Tadatomo Suga

2 ta ish

Meisei University

1. Silicate glass-to-glass hermetic bonding for encapsulation of next-generation optoelectronics: A review

   Laura Granados, R. Morena, Noboru Takamure +4

   Sharh maqola20212 iqtibos

   ABIABI:AkademIndex/2026.other.240092

2. Surface Activated Bonding of Glass Using Aluminum Oxide Intermediate Layer for Microchannel Fabrication

   Kai Takeuchi, Fengwen Mu, Yoshiie Matsumoto +2

   MaqolaNanofabrication and Lithography TechniquesECS Meeting Abstracts20200 iqtibos

   ABIABI:AkademIndex/2020.article.003857