Key engineering materials

26 ta ish

Kitob turkumi · ISSN 1013-9826

1. Low-Inductance Packaging Design for SiC Power MOSFET Modules

   Zhao Bo Zhang, Renze Yu, Saeed Jahdi +3

   MaqolaSilicon Carbide Semiconductor TechnologiesKey engineering materials20260 iqtibos

   ABIABI:AkademIndex/openalex/2026.article.018298