Molecular dynamics simulation and experimental study of tin growth in SAC lead-free microsolder joints under thermo-mechanical-electrical coupling
Long ZhangDepartment of Theoretical and Applied Mechanics, Chongqing University of Science and Technology, Chongqing, 401331, P.R.ChinaDengjie XiongZilong SuJunfeng LiLimeng YinZongxiang YaoGang WangLiping ZhangHehe Zhang
2022en
Ochiq kirish: yoʻq
ABI
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