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Electromagnetic Shielding of Monolayer MXene Assemblies

Taeyeong YunNational Creative Research Initiative Centre for Multi-Dimensional Directed Nanoscale Assembly, Department of Materials Science and Engineering, KAIST Institute for Nanocentury, Daejeon, 34141 KoreaHyerim KimMaterials Architecturing Research Centre Korea Institute of Science and Technology (KIST) Seoul 02792 KoreaAamir IqbalMaterials Architecturing Research Centre Korea Institute of Science and Technology (KIST) Seoul 02792 KoreaYong Soo ChoKU‐KIST Graduate School of Converging Science and Technology Korea University Seoul 02841 KoreaGang San LeeNational Creative Research Initiative Centre for Multi-Dimensional Directed Nanoscale Assembly, Department of Materials Science and Engineering, KAIST Institute for Nanocentury, Daejeon, 34141 KoreaMyung‐Ki KimKU‐KIST Graduate School of Converging Science and Technology Korea University Seoul 02841 KoreaSeon Joon KimNational Creative Research Initiative Centre for Multi‐Dimensional Directed Nanoscale Assembly Department of Materials Science and Engineering KAIST Institute for Nanocentury Daejeon 34141 KoreaDaesin KimKU‐KIST Graduate School of Converging Science and Technology Korea University Seoul 02841 KoreaYury GogotsiNational Creative Research Initiative Centre for Multi-Dimensional Directed Nanoscale Assembly, Department of Materials Science and Engineering, KAIST Institute for Nanocentury, Daejeon, 34141 KoreaSang Ouk KimMaterials Architecturing Research Centre Korea Institute of Science and Technology (KIST) Seoul 02792 KoreaChong Min KooKU‐KIST Graduate School of Converging Science and Technology Korea University Seoul 02841 Korea
2020en
ABI

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Abstract Miniaturization of electronics demands electromagnetic interference (EMI) shielding of nanoscale dimension. The authors report a systematic exploration of EMI shielding behavior of 2D Ti 3 C 2 T x MXene assembled films over a broad range of film thicknesses, monolayer by monolayer. Theoretical models are used to explain the shielding mechanism below skin depth, where multiple reflection becomes significant, along with the surface reflection and bulk absorption of electromagnetic radiation. While a monolayer assembled film offers ≈20% shielding of electromagnetic waves, a 24‐layer film of ≈55 nm thickness demonstrates 99% shielding (20 dB), revealing an extraordinarily large absolute shielding effectiveness (3.89 × 10 6 dB cm 2 g −1 ). This remarkable performance of nanometer‐thin solution processable MXene proposes a paradigm shift in shielding of lightweight, portable, and compact next‐generation electronic devices.

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