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Structural and activation characteristics of nickel creep in the temperature range from 4.2 to 140°K

V. K. AksenovPhysicotechnical Institute, Academy of Sciences of the Ukrainian SSR, Khar’kovI.A. GindinPhysicotechnical Institute, Academy of Sciences of the Ukrainian SSR, Khar’kovV.P. LebedevPhysicotechnical Institute, Academy of Sciences of the Ukrainian SSR, Khar’kovYa. D. StarodubovPhysicotechnical Institute, Academy of Sciences of the Ukrainian SSR, Khar’kov

Soviet Journal of Low Temperature Physicsjournal1980en

ABI

Annotatsiya

We studied the creep of polycrystalline nickel at various levels of stress and determined the activation energy, activation volume, and the effective stresses in the temperature range from 4.2 to 140°K. Using electron microscopy and measurements of the electrical resistivity, we studied the defect structure formed in the transient stage of creep at various temperatures. On the basis of a parallel analysis of the temperature and effective-stress dependences of the activation characteristics as well as the structural state in the course of creep we come to the conclusion that dislocations within the boundaries of cells control the low-temperature creep of nickel over the entire range of temperatures and stresses investigated.

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Mavzular

Intermetallics and Advanced Alloy Properties Semiconductor materials and interfaces Material Properties and Failure Mechanisms

Identifikatorlar

DOI: 10.1063/10.0029990

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