Evolution Mechanism of Surface Discharge Characteristics of Power Device Insulation Packaging

Surface discharge is prone to occur at the interface between silicone gel and ceramic substrates in power modules, which can markedly degrade the insulation reliability of the device. In view of this, this study focuses on the discharge behavior of adhesive-solid insulation subjected to highfrequency electrical stress. Taking into account the solid-liquid biphasic nature and the self-healing capability of silicone gel, the work proposes an alternative perspective by linking surface discharge to bubble evolution, and further provides a systematic discussion of the failure patterns and damage mechanisms of adhesive-solid insulation. The results indicate that discharge pulses are primarily concentrated after voltage polarity reversal and around the voltage peak, while discharge-related parameters show a frequency-dependent trend that increases initially and then decreases. These findings offer useful theoretical guidance for optimizing insulation structure design in IGBT packaging.

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