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Effect of Bonding Agent on Metal‐Ceramic Bond Strength between Co‐Cr Fabricated with Selective Laser Melting and Dental Feldspathic Porcelain

Konstantinos DimitriadisDepartment of Materials Science and Engineering, School of Engineering University of Ioannina GreeceTriantafillos PapadopoulosDepartment of Biomaterials, Dental School National and Kapodistrian University of Athens GreeceSimeon AgathopoulosDepartment of Materials Science and Engineering, School of Engineering University of Ioannina Greece
2019en
ABI

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Abstract Purpose To investigate the effect of bonding agent on the bonding strength between Co‐Cr dental alloy, prepared by selective laser melting (SLM), and feldspathic porcelain. Materials and Methods The experiments were conducted according to ISO 9693 and the conventional protocols for the production of metal‐ceramic dental restorations. After Al 2 O 3 air‐particle abrasion, metal substrates of Co‐Cr dental alloy specimens were bonded, using bonding agent (25 specimens), with dental porcelain positioned in layers (opaque, dentin, enamel). Control specimens (25) were also produced without bonding agent. Bonding strength was measured using 3‐point bending tests, and the results were statistically analyzed using the t‐test and Weibull statistics. Elemental (by SEM/EDS) and crystallographic analyses (by XRD) were conducted on the bonding agent, along cross sections of alloy‐porcelain interfaces, and on fracture surfaces. Results Cohesive fracture occurred (on the porcelain side). The application of the bonding agent decreased the average bonding strength (from 42.27 ± 5.85 to 36.25 ± 3.26 MPa, P = 0.00006), attributed to the nonexisting reaction between the TiO 2 ‐rich bonding agent and the Co‐Cr alloy, but it increased the Weibull modulus (from 7.84 to 12.16), which reflects the reliability of the bond in the tested metal‐ceramic specimens. Conclusions Although the application of bonding agent slightly decreased the bonding strength, all the measured values of the metal‐ceramic specimens produced by the SLM technique, with or without the bonding agent, are markedly higher than the minimum value required by ISO 9693 (25 MPa). Moreover, the use of bonding agent favors the increase of the Weibull modulus.

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