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Deterministic Manipulation of Heat Flow via Three-Dimensional-Printed Thermal Meta-Materials for Multiple Protection of Critical Components

Senyuan YangState Key Laboratory of Power Transmission Equipment and System Security and New Technology, School of Electrical Engineering, Chongqing University, Chongqing 400044, ChinaYingfan ZhangState Key Laboratory of Power Transmission Equipment and System Security and New Technology, School of Electrical Engineering, Chongqing University, Chongqing 400044, ChinaZhou ShaState Key Laboratory of Power Transmission Equipment and System Security and New Technology, School of Electrical Engineering, Chongqing University, Chongqing 400044, ChinaZhengyong HuangState Key Laboratory of Power Transmission Equipment and System Security and New Technology, School of Electrical Engineering, Chongqing University, Chongqing 400044, ChinaHaohuan WangState Key Laboratory of Power Transmission Equipment and System Security and New Technology, School of Electrical Engineering, Chongqing University, Chongqing 400044, ChinaFeipeng WangState Key Laboratory of Power Transmission Equipment and System Security and New Technology, School of Electrical Engineering, Chongqing University, Chongqing 400044, ChinaJian LiState Key Laboratory of Power Transmission Equipment and System Security and New Technology, School of Electrical Engineering, Chongqing University, Chongqing 400044, China

2022en

ABI

Annotatsiya

Heat dissipation is necessary for the safer operation of high-power electronic devices and high-capacity batteries. Thermal meta-materials can efficiently manipulate heat flow by molding natural materials into specific structures. In this study, we construct a three-dimensional-printed meta-material structure with efficient and deterministic heat conduction through combining the 2D boron nitride (BN) with nano-diamond (DM) bridging. A research of thermal conductivity and dielectric properties exhibits that the nanosized diamond-bridged and oriented 2D boron nitride endows efficient heat transfer and maintains low dielectric loss with low filler loading. The composites loaded with 19 wt% BN platelets and 1 wt% DM have the highest thermal conductivity of 3.687 W/(m·K) in the heat flow orientation, while the thermal conductivity is only 0.632 W/(m·K) in the vertical heading of heat flow. The thermal conductive networks with thermal meta-materials based on the structural characteristics have been designed to secure critical device components from the heat source and dissipate heat flow in a definite way. The infrared images show that the temperature difference of monitoring points in different directions on the BN-oriented composite substrate is 9 °C, which realizes the protection of the heat source and key components. This study shows the latent capacity of 3D-printed structured materials for critical device component protection and heat administration applications in electronic devices and electric equipment.

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Identifikatorlar

DOI: 10.1021/acsami.2c09602

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