An adaptive thermal management method via bionic sweat pores on electronic devices
Lihang YuInstitute of Microelectronics of the Chinese Academy of Sciences, Beijing 100029, ChinaBinbin JiaoInstitute of Microelectronics of the Chinese Academy of Sciences, Beijing 100029, ChinaYuxin YeInstitute of Microelectronics of the Chinese Academy of Sciences, Beijing 100029, ChinaXiangbin DuInstitute of Microelectronics of the Chinese Academy of Sciences, Beijing 100029, ChinaYanmei KongInstitute of Microelectronics of the Chinese Academy of Sciences, Beijing 100029, ChinaRuiwen LiuInstitute of Microelectronics of the Chinese Academy of Sciences, Beijing 100029, ChinaJingping QiaoInstitute of Microelectronics of the Chinese Academy of Sciences, Beijing 100029, ChinaShichang YunInstitute of Microelectronics of the Chinese Academy of Sciences, Beijing 100029, ChinaZhiqiang WangInformation Science Academy of China Electronics Technology Group Corporation, Beijing 100086, ChinaWei LiInformation Science Academy of China Electronics Technology Group Corporation, Beijing 100086, ChinaYingzhan YanInformation Science Academy of China Electronics Technology Group Corporation, Beijing 100086, ChinaDichen LuInstitute of Microelectronics of the Chinese Academy of Sciences, Beijing 100029, ChinaZiyu LiuInstitute of Microelectronics of the Chinese Academy of Sciences, Beijing 100029, ChinaRonggui YangHuazhong University of Science and Technology, Wuhan, Hubei 430074, China
2024en
ABI
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