Analysis on ground surface in ultrasonic face grinding of silicon carbide (SiC) ceramic with minor vibration amplitude
Chenwei DaiCollege of Mechanical Engineering, Suzhou University of Science and Technology, Suzhou, 215009, PR ChinaZhen YinCollege of Mechanical Engineering, Suzhou University of Science and Technology, Suzhou, 215009, PR ChinaPing WangCollege of Electrical and Information Engineering, Lanzhou University of Technology, Lanzhou, 730050, PR ChinaQing MiaoCollege of Mechanical Engineering, Suzhou University of Science and Technology, Suzhou, 215009, PR ChinaJiajia ChenCollege of Mechanical and Electronic Engineering, Nanjing Forestry University, Nanjing, 210016, PR China
2021en
ABI
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