Material removal mechanism of SiC ceramics by elliptic ultrasonic vibration-assisted grinding (EUVAG) using single grain
Kun ZhangSchool of Mechanical Engineering, Suzhou University of Science and Technology, Suzhou, 215009, PR ChinaZhen YinSchool of Mechanical Engineering, Suzhou University of Science and Technology, Suzhou, 215009, PR ChinaChenwei DaiSchool of Mechanical Engineering, Suzhou University of Science and Technology, Suzhou, 215009, PR ChinaQing MiaoSchool of Mechanical Engineering, Suzhou University of Science and Technology, Suzhou, 215009, PR ChinaPeng ZhangSchool of Mechanical Engineering, Suzhou University of Science and Technology, Suzhou, 215009, PR ChinaZiyang CaoSchool of Mechanical Engineering, Suzhou University of Science and Technology, Suzhou, 215009, PR China
2022en
ABI
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