In situ monitoring of the strain evolution and curing reaction of composite laminates to reduce the thermal residual stress using FBG sensor and dielectrometry
Hak‐Sung KimDepartment of Mechanical Engineering, Hanyang University, Seoul, Republic of KoreaSeong-Hwan YooSchool of Mechanical Engineering, Chung-Ang University, Seoul, Republic of KoreaSeung‐Hwan ChangSchool of Mechanical Engineering, Chung-Ang University, Seoul, Republic of Korea
2012en
ABI
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