Grinding and lapping induced surface integrity of silicon wafers and its effect on chemical mechanical polishing
Shang GaoKey Laboratory for Precision and Non-Traditional Machining Technology of Ministry of Education, Dalian University of Technology, Dalian 116024, ChinaHonggang LiKey Laboratory for Precision and Non-Traditional Machining Technology of Ministry of Education, Dalian University of Technology, Dalian 116024, ChinaHan HuangSchool of Mechanical and Mining Engineering, The University of Queensland, QLD 4072, AustraliaRenke KangKey Laboratory for Precision and Non-Traditional Machining Technology of Ministry of Education, Dalian University of Technology, Dalian 116024, China
2022en
ABI
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